More: Deep Space Exploration > Satellite Integration > Spacecraft & Launch Vehicles > Laser Communications
The performance parameters that must be addressed when considering power handling within the spaceflight environment are the three main failure mechanisms that can lead to RF breakdown: Thermal limitations of the materials, multipaction, and ionization.
Multipaction Keeping power completely within an interconnect requires more than just shielding stray electrons from bouncing around a vacuum. Proper design, materials selection, and quality construction are essential for all interconnects within a system. One bad cable can ruin an entire system. Amphenol CIT engineers understand the complexities and challenges that arise from multipaction, and are experts at keeping electrons moving along their desired transmission path.
Ionization We implement the highest quality controls during the design and assembly processes to control the critical geometries, venting, and cleanliness to prevent the risk of a partial atmosphere or outgassing constituents becoming trapped within the transmission path leading to a corona and eventual RF breakdown.
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| Cable Assemblies & Harnesses | Fast Steering Mirror (FSM) Sensors | Shielding & Overbraiding | Connectors & Accessories | Wire & Cable |
| RF/Microwave Fiber Optic Spaceflight Flexible Ultra-lightweight Semi-rigid Delay lines Fabricated cables Harnesses | High bandwidth High resolution Low power consumption Excellent temp stability Matched sensor for high stability & repeatability Radiation tolerant | Spaceflight Reliable Industry-Leading Electrical Conductivity Light Weight Stronger than Steel Flexible Affordable | Spaceflight High-density Self-locking Multiport quick-connect High-power Filtered | Flexible Semi-rigid Hand-formable High-voltage High-temp Moisture-resistant |
