Amphenol CIT launched the SMP “push-on” connector product line two decades ago to facilitate dense packaging within RF/Microwave systems.
The SMP interface has enabled design engineers to increase performance and complexity of their designs and improve upon their form factor. The SMP interconnect series relies on a floating female-to-female adapter—commonly referred to as a “bullet”— to enable stacking of boards equipped with an SMP male PCB connector. This durable construction and ability to tolerate radial and axial misalignment allows for a blindmate interconnect solution. SMP connectors can also withstand multiple engagement/disengagement cycles without degradation in electrical performance.
The success of the SMP product line has spurred the development and commercialization of other blindmate interconnect systems – namely the SSMP®, TMP® and WMP® to facilitate rapid assembly and testing for the gamut of Military and Commercial RF/Microwave applications.
Features
Frequency Range: DC - 40 GHz
50 Ω Impedance; Blindmateable configuration
Industry standard per MIL-STD-348
MIL-PRF-39012 compliant
Ability to withstand Radial/Axial Misalignment
Board-mount, field-replaceable, bullets, hermetic and cable connector configurations
