Amphenol CIT SMPS series is designed to satisfy demand for increased package density and reduced weight in microwave systems. The sub-miniature, lightweight blind-mateable interconnect solution is ideal for complex high-performance microwave modules and systems where weight is the primary issue.
Amphenol CIT’s SMPS series are a perfect solution for military radios, radars, space, and test applications. The design of the push-on interface enables use in microwave modules and dense packages, and facilitates rapid assembly and testing. The available bullet sizes allow for a PCB stackable height of <0.120”. The ability to tolerate radial and axial misalignment allows for multiple engagement/disengagement cycles without degradation in electrical performance.
To inquire about SMPS Interconnect Series available from Amphenol CIT, please fill out the form below, and one of our Sales Engineers will contact you.
