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AltaVel - Available 1Q 2018

When Signal Integrity and Density Matter

Carlisle Interconnect Technologies' (CarlisleIT) AltaVel family of open pin field High Speed Digital (>25 Gbps) Interconnect is optimized to provide scalability and reliability in dense, high mate/de-mate cycles applications. The broad family of connectors are available in the following configurations; Board to Board, Board to Cable, Cable to Cable and Cable to Panel. All configurations are available in the following styles; Vertical to Vertical, Right Angle to Vertical and Right Angle to Right Angle. These standard connectors are part of CarlisleIT's full lineup of cost effective, off the shelf and customizable interconnect solutions delivering superior signal integrity performance and value. This product available 1Q 2018.

Suggested Applications

  • High speed digital boards and systems

  • High speed digital HW and system verification

  • Network systems

  • Servers & storage – blade and rack mount

  • Switches

  • Routers

  • Optical transport carrier grade optical

  • Wireless infrastructure

Download the CarlisleIT AltaVel Product Overview (.pdf)

AltaVel Features and Benefits

Feature Customer Benefit
10,000 mate/de-mate cycles High signal integrity and reliability in a long life package ensures high performance and lower cost of ownership
Flexible, scalable design High capacity design provides multiple configurations, enabling optimum performance at lowest total cost
Size ranges from 40 to 200 pins; configurable in 4 rows by 10, 20, 30, 40 or 50 columns
With or without metal shells Rugged/EMI housing option is a readily available option for applications used in extreme environments
Open pin field design Design allows for flexibility in routing and coding schemes, including: single-ended, differential pair, power, ground, and sideband signals
Impedance:
  Differential - 85 and 100 ohm
  Single ended - 50 and 75 ohm
Multiple impedance options ensures a solution to meet your application

AltaVel

Contact system (1), board-to-board with metal shell (2), and without metal shell (3) available

AltaVel Specifications and Performance

Parameter Specifications
Insertion Loss <0.8 dB to 25Ghz (interconnect only)*
Data Rate FDR - 14Gb/s, EDR - 26Gb/s & PCIe Gen4 - 16Gb/s
Impedance 85 or 100 ohm differential impedance;
50 or 75 ohm single-ended impedance
Contact rating 3 amp max, at ambient with 30° rise
Operating Temperature -55˚C to +125˚C
Minimum Contact Wipe 1 mm (0.039") typical
Contact Mating Force 40 grams typical
Insulation Resistance 5,000 megaohms minimum @ 500 VDC
DC Resistance (mated pair) 8.5 milliohm @ 8mm stack height
Durability min 1,000 cycles and up to 10,000 mate/demate cycles
Sinusoidal Vibration 20g (EIA-364-28, condition IV)
Shock 50 g (EIA-364-27, condition E)
Operating Voltage 200 V, RMS, 60 Hz typical
*Simulated data only
Materials & Finishes
Pin Contacts BeCu per ASTM B194, plated 30 - 50 μin gold over100 μin nickel minimum in mated contact area, 5 μin gold over 100 μin nickel on tailsp
Socket Contacts BeCu per ASTM B194, plated 30 - 50 μin gold over100 μin nickel minimum in mated contact area, 5μin gold over 100 μin nickel on tails
Contact Finish Localized gold finish per ASTM B488 over nickel per ASTM B689 Type 1
Molded Insulators 30% glass-filled LCP per ASTM D5138
Hardware Stainless steel
Shell (ruggedized) Aluminum alloy
Finish (ruggedized) Nickel plated
RoHS Compliant: Yes
Solderable: Lead or lead-free

Insertion and Return Loss (Simulated)

Crosstalk (Simulated)

Test Set Up - Differential Simulation included Footprint and Break-out Region + 6mm

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For more information on CarlisleIT Test and Measurement solutions, contact Steve Begley at (+1) 562-498-0901 x2438